质量的年代tandards and Environmental Certifications

ATS693LSG:三线式差分抗振传感器 IC（带速度和方向输出）

ATS693LSG 数据表
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Description

ATS693LSG 是一款经过优化的霍尔效应 IC 与稀土磁铁组合体，可以提供用于测向和真零速数字齿轮齿感测的用户友好型解决方案。该小型封装可以很方便地组装，并用于各种齿轮传感应用。

该 IC 采用了专利算法，可满足汽车传输应用的特殊操作要求。同构可变脉宽输出协议传输目标速度和方向信息。ATS693 在振动处理方面有着出色的表现，而且不会牺牲最大气隙容量也不会产生任何错误的方向信息。设备甚至可以完全排除发动机曲柄转动产生的较高角振动。高级的振动探测算法可以系统化地校准真正目标旋转的初始齿的传感器 IC 而不是振动传感器 IC，从而可以始终保证运行模式中始终获得正确的信号。

凭借高级信号处理和创新算法，ATS693 成为各种速度和方向感测应用中的理想解决方案。

本设备采用无铅 4 脚 SIP 封装，且引脚框采用 100% 雾锡电镀。

Top Features

  • 三线、脉宽输出协议
  • 表示目标配置文件的数字输出
  • 目标速度和方向信息
  • 振动容差
    • 小幅度振动的微弱信号锁定
    • 大幅度振动的专利振动探测算法
  • 气隙独立开关点
  • 较大的工作气隙容量
  • 欠压锁定
  • 真零速操作
  • 较宽的工作电压范围
  • 可实现高可靠性的单芯片感测 IC
  • 牢固测试覆盖能力，包括扫描路径和 IDDQ 测量
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Part Number Specifications and Availability

Part Number Package Type Temperature RoHS
Compliant		 Part Composition /
RoHS Data		 Comments Samples Check Stock
ATS693LSGTN-RSNYPH-T 4-lead SIP -40°C to 150°C Yes View Data Contact your
local sales rep		 Check
Distributor Stock

Allegro 的产品不允许在任何由于 Allegro 产品的合理故障造成人身伤害的装置或系统中使用，包括但不限于生命支持装置或系统。

Packaging

封装

见解和创新

Semiconductors (general)

Allegro Hall-Effect Sensor ICs

This note provides a basic understanding of the Hall effect and how Allegro designs and implements Hall technology in packaged semiconductor monolithic integrated circuits.

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Semiconductors (general)

Hall-Effect IC Applications Guide

Allegro MicroSystems uses the latest integrated circuit technology in combination with the century-old Hall effect to produce Hall-effect ICs. These are contactless, magnetically activated switches and sensor ICs with the potential to simplify and improve electrical and mechanical systems.

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Semiconductors (general)

Integrating Hall-Effect Magnetic Sensing Technology into Modern Household Appliances

As technology improves, Hall-effect sensor ICs are finding their way into many modern household appliances. The Hall effect refers to the measurable voltage that appears across a conductive material.

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Semiconductors (general)

Magnetic Sensor ICs Offer Integrated Diagnostics for ASIL Compliance

The ever-evolving requirements of the automotive, industrial, and commercial markets for increased reliability and functionality will continue to drive demand for electronic content, including non-contact magnetic sensor ICs with diagnostics.

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Packaging

Allegro Microsystems - Chemical Exposure of Devices

This application note discusses the types of situations and applications that can give rise to failure of the device from corrosion.

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Semiconductors (general)

Allegro MicroSystems - Soldering Methods for Allegro Products (SMD and Through-Hole)

本文档描述了典型的焊接方法that have been proven effective with Allegro™ products. It provides information on SMD (surface mount devices) and through-hole packages. Both lead (Pb) free and traditional Pb-based technologies are examined.

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Packaging

Back-Biased Packaging Advances (SE, SG, SH, and SJ versus SA and SB)

Magnetic circuit elements and the use of high-temperature materials have resulted in lower total system costs for manufacturers using them in final sensor module products. Innovative package design and assembly technology have produced smaller, more powerful devices.

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Packaging

Guidelines for Designing Subassemblies Using Hall-Effect Devices

This document covers most of the assembly methods used for mounting Hall-effect devices. In Allegro® Hall-effect devices, the signal is conditioned and optimized for various types of magnetic inputs to produce a suitable electrical output.

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Packaging

Guidelines for Leadforming Using Back-Biased Hall-Effect Devices

AN296080 - This application note provides specific information and general ideas to consider when designing tools to accomplish the final preparation of the device. The application note Guidelines for Designing Subassemblies Using Hall-Effect Devices, AN27703, must be used in conjunction with this ...

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