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The RoHS Directive was adopted by the European Union in January of 2003. Its strictures must be met by newly-designed products sold into the EU after the beginning of July 2006.

RoHS meansReduction of Hazardous Substances. It has been amended to accommodate additional exemptions (18 August 2005; amending Directive 2002/95/EC of the European Parliament and of the Council for the purpose of establishing the maximum concentration values for certain hazardous substances in electrical and electronic equipment).

A product that strictly meets all of the standard requirements of RoHS is considered to "comply" with RoHS. The RoHS directive also provides a defined set of exemption categories, such as for critical applications, manufacturing technologies for which there is no current substitute, and materials which could contain extremely low concentrations of restricted materials as constituent elements. Products that are included in these categories are considered "exempt" from the standard RoHS restrictions, and are permitted to be used.

With regard to low-concentration exemptions, Allegro maintains a rigorous program to ensure that our products fall below the allowable concentration levels.

With regard to technology exemptions, internal flip-chips, an advanced technology that uses high-temperature Pb-alloy solder bumps sealed inside of the device package, are used in certain device families, such as the Allegro ACS704 through ACS708, and the ACS760 device families (refer to the individual product datasheets for this information). Flip-chips are explicitly exempted by RoHS because there is currently no substitute technology. Allegro provides these devices in packages with 100% matte tin leadframe plating, thus avoiding any other significant use of Pb in these packages.

In addition, there is a general RoHS exemption for high-temperature solder. High-temperature solder does contain Pb, but RoHS exempts it (in concentrations of Pb >85% by weight) because there is currently no substitute technology. Certain Sanken packages include exempted high-temperature solder (refer to the individual product datasheets for this information).

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The Pb-free devices have the same quality and reliability standards as traditional products. Additional attention to handling may be required to ensure compliance with MSL protocols due to the elevated temperatures used in Pb-free processes.

The preferred plating used by Allegro is 100% matte tin.

There have been no detected effects of matte tin plating.

通过对模块，离散组件或复合材料的施用来解释RoHS指令的均质措辞对Allegro产品的设计和制造具有显着影响。在评估其产品时，Allegro将该指令应用于包含其产品的材料，并主动进行这些材料的各种组成元素的详细化学分析。该研究一直在广泛，并纳入第三方材料供应商与Allegro之间的密切合作，各种Allegro俘虏制造和开发设施的流程工程，分包制造商的过程工程和采购。

The specification range thickness of the matte tin is 300 micro inches to 800 micro inches. The target mean thickness is 450 micro inches. This thickness has been shown to retard tin whiskers, in conjunction with other process steps.

No undercoating is used under the plating on the leadframe.

The leadframes are composed of copper alloy.

All tin-plated devices are susceptible to tin whisker growth. No guarantees can be made for a tin whisker free product with tin-plated devices. Allegro continually keeps up and actively participates in the iNEMI and JEDEC industry tin whiskers task forces. All Allegro 100% matte tin, low organics, plated devices are mitigated for tin whisker growth with a 1 hour at 150°C anneal process performed within 24 hours of plating.

Allegro and Allegro partners have been conducting tin whisker monitoring of 100% tin plated devices for the past five years. Assembly locations where Allegro matte tin plating is done have plated over 1 billion devices since 1999. To date, there has been no reports of failures attributed to tin whiskers.

Allegro在其产品中不使用BI或其合金。可以在组成材料中发现痕量，但不能显着，但不具有显着量。

IPC标准J-STD-001D涵盖焊接材料和工艺。在这种修订中，它包括有关PB的信息的信息。

MSLs (moisture sensitivity level) comprise a rating system for determining the proper handling protocols for surface mount packages, in order to avoid damage during the solder reflow process. The MSLs are provided in industry standard J-STD-020. Handling procedures are described in J-STD-033.

To avoid delamination from vaporization effects, take care to avoid exceeding the maximum floor life of the devices. In this context, floor life is linked to the rate at which the device absorbs atmospheric moisture, represented by the MSL rating, with MSL 1 being the most resistant to delamination. MSL ratings are linked to peak process temperatures. If processing near maximum temperature levels, it may be necessary to handle devices according to protocols for lower MSL levels.

Allegro testing follows J-STD-020, using 260°C for peak reflow temperature. Information on the MSL rating is provided on the device packing labels.

All Allegro testing requiring Pb-Free reflow uses the J-STD-020 industry standard profile (shown below). As long as the optimized Pb-free reflow profile being used falls inside this profile, Allegro testing results apply. Due to the large number of parameters that must be optimized and factors that must be taken into account, the optimal Pb-free reflow profile for any given component needs to be determined by the end user in the context of the final application configuration and of the manufacturing or rework conditions.

在semiconducto Pb实际上有一个有限的存在r devices. The only place where it has been commonly present in significant concentrations, as defined by RoHS, is in the SnPb alloy plating material that has traditionally been used to enhance leadframe solderability. By using 100% matte tin leadframe plating, Allegro eliminates even this contributor of Pb.

Pb is also present in the high-temperature solders used to bond flip-chips. There is currently no substitute for this technology, and flip-chip devices are exempted by RoHS. Allegro does supply some flip-chip devices, however, even though high-temperature solder may be present in the interior of the device, 100% matte tin leadframe plating is used, eliminating Pb from the exposed areas of the devices.

可以通过参考设备的文档来确定特定allegro设备变体的无铅状态。大多数Allegro产品具有非常小的物理尺寸，因此出于易读或客户处理要求，各个设备包上的品牌代码通常无法显示完整的识别信息，并且设备文档是最佳源。

在semiconducto Pb实际上有一个有限的存在r devices. The only place where it has been commonly present in significant concentrations, as defined by RoHS, is in the SnPb alloy plating material that has traditionally been used to enhance leadframe solderability. By using 100% matte tin leadframe plating, Allegro eliminates even this contributor of Pb.

Pb is also present in the high-temperature solders used to bond flip-chips. There is currently no substitute for this technology, and flip-chip devices are exempted by RoHS. Allegro does supply some flip-chip devices, however, even though high-temperature solder may be present in the interior of the device, 100% matte tin leadframe plating is used, eliminating Pb from the exposed areas of the devices.

可以通过参考设备的文档来确定特定allegro设备变体的无铅状态。大多数Allegro产品具有非常小的物理尺寸，因此出于易读或客户处理要求，各个设备包上的品牌代码通常无法显示完整的识别信息，并且设备文档是最佳源。

The category used is "e3" for most standard Allegro devices. This is a reference to the industry standard JESD97 for second level interconnect (device-to-PCB) connection for tin-plated devices.

Currently, Allegro supplies both Pb-free (100% matte tin) leadframe plating as well as SnPb plating. Device variants with 100% matte tin leadframe plating generally are indicated by a "–T" suffix, appended to the end of the complete part number for the variant. (The best source for the complete part number is the documentation for the device, because the complete part number generally does not appear in the individual device markings.) The exceptions are the ACS704 through ACS707, and the ACS75x device families, which have 100% matte-tin leadframe plating, but do not use the "–T" notation.

Allegro has been producing Pb-free devices for several years. For availability in a particular device, consult the datasheet for the device type, and contact your local Allegro representative for lead times.

Allegro continues to provide traditional Pb-base devices available, however, we recommend conversion to Pb-free variants as they become available.

快板冰铜选择100%锡引线框架平台ing, a technology which has been widely demonstrated to be backwardly-compatible with existing SnPb-based processes.

SnPb leadframe plating can be used with certain Pb-free solder pastes, as shown in the following table:

The term "green" is used generally to refer to products that have been designed with a goal of compatibility with the natural environment.

"Molding compounds" are the materials which are used to create the casing that surrounds and isolates the active elements of an integrated circuit package.

Current industry practice defines a green molding compound as one that is not only free of halogens and antimony trioxide, but also complies with RoHS (refer to the FAQ with the Table of Definitions for maximum allowable levels). Allegro is continually evaluating environment-friendly green molding compounds, while testing for equivalent or better performance and long-term reliability.

Allegro has been providing Pb-Free packages for several years. The following Allegro packages are already green: eSOIC and FCOL SOICs, eLQFP, TSSOPs and eTSSOPs, TQFPs and eTQFPs, MLPs (QFNs) and MSOPs. This list is being updated as more packages are qualified with green molding compounds.