常问问题

The RoHS Directive was adopted by the European Union in January of 2003. Its strictures must be met by newly-designed products sold into the EU after the beginning of July 2006.

RoHS meansReduction of Hazardous Substances。It has been amended to accommodate additional exemptions (18 August 2005; amending Directive 2002/95/EC of the European Parliament and of the Council for the purpose of establishing the maximum concentration values for certain hazardous substances in electrical and electronic equipment).

一款严格符合RoHS所有标准要求的产品被认为是“符合RoHS的”符合“。RoHS指令还提供了一组定义的豁免类别，例如关键应用，没有电流替代品的制造技术，以及可能含有极低浓度的限制材料作为组成元素的材料。雷竞技最新网址这些类别中包含的产品被视为“豁免”标准RoHS限制，并被允许使用。

With regard to low-concentration exemptions, Allegro maintains a rigorous program to ensure that our products fall below the allowable concentration levels.

关于技术豁免，内部折叠芯片，一种使用在设备包内部密封的高温PB-合金焊料凸块的先进技术，可用于某些设备系列，例如Allegro ACS704至ACS708和ACS760设备家庭（参见此信息的个人产品数据表）。翻转芯片明确豁免RoHS，因为目前没有替代技术。Allegro在具有100％哑光锡引线框架的封装中提供这些设备，从而避免在这些封装中的任何其他显着使用PB。

此外，还有一般的RoHS豁免高温焊料。高温焊料确实含有Pb，但RoHS豁免它（浓度为PB> 85％（重量），因为目前没有替代技术。某些Sanken封装包括豁免的高温焊料（参见此信息的各个产品数据表）。

Allegro对领先行业伙伴关系计划的成员致力于承诺。点击此处了解有关详情Allegro partnering and certifications。

PB的设备具有与传统产品相同的质量和可靠性标准。可能需要额外注意处理，以确保由于PB的无铅过程中使用的高温而遵守MSL协议。

The preferred plating used by Allegro is 100% matte tin.

There have been no detected effects of matte tin plating.

均质材料的解释的ph值rasing of the RoHS directive, as applying to modules, discrete components, or composite materials, has a significant impact on the design and manufacture of Allegro products. When assessing its products, Allegro applies the directive to the materials that comprise its products, and has taken the initiative to perform detailed chemical analyses of the various constituent elements of those materials. This study has been extensive, and has included close cooperation between third-party suppliers of materials to Allegro, process engineering at the various Allegro captive manufacturing and development facilities, process engineering at subcontracting manufacturers, and procurement.

The specification range thickness of the matte tin is 300 micro inches to 800 micro inches. The target mean thickness is 450 micro inches. This thickness has been shown to retard tin whiskers, in conjunction with other process steps.

No undercoating is used under the plating on the leadframe.

The leadframes are composed of copper alloy.

All tin-plated devices are susceptible to tin whisker growth. No guarantees can be made for a tin whisker free product with tin-plated devices. Allegro continually keeps up and actively participates in the iNEMI and JEDEC industry tin whiskers task forces. All Allegro 100% matte tin, low organics, plated devices are mitigated for tin whisker growth with a 1 hour at 150°C anneal process performed within 24 hours of plating.

Allegro and Allegro partners have been conducting tin whisker monitoring of 100% tin plated devices for the past five years. Assembly locations where Allegro matte tin plating is done have plated over 1 billion devices since 1999. To date, there has been no reports of failures attributed to tin whiskers.

Allegro does not use Bi or its alloys in its products. Trace quantities may be found as impurities in constituent materials, but not in significant amounts.

The IPC standard J-STD-001D covers soldering materials and processes. In this revision it includes information about Pb-free manufacturing.

MSLs (moisture sensitivity level) comprise a rating system for determining the proper handling protocols for surface mount packages, in order to avoid damage during the solder reflow process. The MSLs are provided in industry standard J-STD-020. Handling procedures are described in J-STD-033.

为避免蒸发效果的分层，请注意避免超过设备的最大地板寿命。在这种情况下，地板寿命与装置吸收大气湿度的速率相关，由MSL额定值表示，MSL 1是最抗分层的。MSL评级与峰值过程温度相关联。如果在最高温度水平附近处理，则可能需要根据用于较低的MSL水平的协议处理设备。

Allegro testing follows J-STD-020, using 260°C for peak reflow temperature. Information on the MSL rating is provided on the device packing labels.

All Allegro testing requiring Pb-Free reflow uses the J-STD-020 industry standard profile (shown below). As long as the optimized Pb-free reflow profile being used falls inside this profile, Allegro testing results apply. Due to the large number of parameters that must be optimized and factors that must be taken into account, the optimal Pb-free reflow profile for any given component needs to be determined by the end user in the context of the final application configuration and of the manufacturing or rework conditions.

在semiconducto Pb实际上有一个有限的存在r devices. The only place where it has been commonly present in significant concentrations, as defined by RoHS, is in the SnPb alloy plating material that has traditionally been used to enhance leadframe solderability. By using 100% matte tin leadframe plating, Allegro eliminates even this contributor of Pb.

Pb is also present in the high-temperature solders used to bond flip-chips. There is currently no substitute for this technology, and flip-chip devices are exempted by RoHS. Allegro does supply some flip-chip devices, however, even though high-temperature solder may be present in the interior of the device, 100% matte tin leadframe plating is used, eliminating Pb from the exposed areas of the devices.

The Pb-free status of a particular Allegro device variant can be determined by referring to the documentation for the device. Most Allegro products have very small physical dimensions, so for reasons such as legibility or customer processing requirements, branding codes on individual device packages generally cannot display complete identifying information, and device documentation is the best source.

在semiconducto Pb实际上有一个有限的存在r devices. The only place where it has been commonly present in significant concentrations, as defined by RoHS, is in the SnPb alloy plating material that has traditionally been used to enhance leadframe solderability. By using 100% matte tin leadframe plating, Allegro eliminates even this contributor of Pb.

Pb is also present in the high-temperature solders used to bond flip-chips. There is currently no substitute for this technology, and flip-chip devices are exempted by RoHS. Allegro does supply some flip-chip devices, however, even though high-temperature solder may be present in the interior of the device, 100% matte tin leadframe plating is used, eliminating Pb from the exposed areas of the devices.

The Pb-free status of a particular Allegro device variant can be determined by referring to the documentation for the device. Most Allegro products have very small physical dimensions, so for reasons such as legibility or customer processing requirements, branding codes on individual device packages generally cannot display complete identifying information, and device documentation is the best source.

用于大多数标准Allegro设备的类别为“E3”。这是对镀锡设备的第二级互连（Device-To-PCB）连接的行业标准JESD97的参考。

目前,快速的供应都Pb-free(100%垫te tin) leadframe plating as well as SnPb plating. Device variants with 100% matte tin leadframe plating generally are indicated by a "–T" suffix, appended to the end of the complete part number for the variant. (The best source for the complete part number is the documentation for the device, because the complete part number generally does not appear in the individual device markings.) The exceptions are the ACS704 through ACS707, and the ACS75x device families, which have 100% matte-tin leadframe plating, but do not use the "–T" notation.

Allegro几年来一直生产无铅设备。有关特定设备的可用性，请参阅设备类型的数据表，并与您的当地Allegro代表联系以获得交付时间。

Allegro继续提供传统的PB基础设备，但是，我们建议转换为无铅型号，因为它们可用。

Allegro has selected 100% matte tin leadframe plating, a technology which has been widely demonstrated to be backwardly-compatible with existing SnPb-based processes.

SnPb leadframe plating can be used with certain Pb-free solder pastes, as shown in the following table:

The term "green" is used generally to refer to products that have been designed with a goal of compatibility with the natural environment.

"Molding compounds" are the materials which are used to create the casing that surrounds and isolates the active elements of an integrated circuit package.

Current industry practice defines a green molding compound as one that is not only free of halogens and antimony trioxide, but also complies with RoHS (refer to the FAQ with the Table of Definitions for maximum allowable levels). Allegro is continually evaluating environment-friendly green molding compounds, while testing for equivalent or better performance and long-term reliability.

Allegro已经提供了几年的免费封装。以下Allegro软件包已经是绿色的：ESOCE和FCORSICE，ELQFP，TSSOPS和ETSSOPS，TQFPS和ETQFPS，MLP（QFN）和MSOPS。随着更多封装与绿色成型化合物有资格，可以更新此列表。